Deep reactive ion etching of Si-based materials Oxford Instruments Plasma Technology PlasmaPro 100 (DRIE)

Deep reactive ion etching of Si-based materials Oxford Instruments Plasma Technology PlasmaPro 100
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Guarantor: Mgr. Marek Eliáš, Ph.D.
Technologie / Metodologie: Etching & Deposition
Instrument status: Operational Operational, 2.10.2023 13:13
Equipment placement: CEITEC Nano - C1.34
Výzkumná skupina: CF: CEITEC Nano


Popis:

Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes, and trenches in wafers/substrates, typically with high aspect ratios. It was developed for microelectromecha­nical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM and more recently for creating through silicon via´s (TSV)´s in advanced 3D wafer-level packaging technology.
There are two main technologies for high-rate DRIE: cryogenic and Bosch, although the Bosch process is the only recognized production technique. Both Bosch and cryo processes can fabricate 90° (truly vertical) walls, but often the walls are slightly tapered, e.g. 88° („reentrant“) or 92° („retrograde“).
Another mechanism is sidewall passivation: SiOxFy functional groups (which originate from sulfur hexafluoride and oxygen etch gases) condense on the sidewalls and protect them from lateral etching. As a combination of these processes deep vertical structures can be made.


Publications:

  • CHMELÍKOVÁ, L.; FECKO, P.; CHMELÍK, J.; SKÁCEL, J.; OTÁHAL, A.; FOHLEROVÁ, Z., 2023: Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications. APPLIED MATERIALS TODAY , p. 1 - 12, doi: 10.1016/j.apmt.2023.101736; FULL TEXT
    (DRIE, PARYLENE, SUSS-MA8, XEF2)
  • Mahel, V., 2023: Variable MEMS aperture for electron microscopy. MASTER´S THESIS ; FULL TEXT
    (DWL, DRIE, DEKTAK, DIENER, WIRE-BONDER)
  • GABLECH, I.; BRODSKÝ, J.; VYROUBAL, P.; PIASTEK, J.; BARTOŠÍK, M.; PEKÁREK, J., 2022: Mechanical strain and electric-field modulation of graphene transistors integrated on MEMS cantilevers. JOURNAL OF MATERIALS SCIENCE 57(3), p. 1923 - 13, doi: 10.1007/s10853-021-06846-6; FULL TEXT
    (RIE-FLUORINE, DRIE, EVAPORATOR, WIRE-BONDER, WITEC-RAMAN, MPS150, KEITHLEY-4200, SUSS-MA8, DWL)
  • Ondříšková, M., 2022: Analysis and characterisation of spirally–arranged field–emission nanostructure. BACHELOR´S THESIS , p. 1 - 56; FULL TEXT
    (VERIOS, DRIE, KRATOS-XPS)
  • Brodský J., 2021: Gas sensors based on 1D and 2D materials. MASTER´S THESIS , p. 1 - 84; FULL TEXT
    (DWL, DIENER, SUSS-RCD8, SUSS-MA8, EVAPORATOR, MPS150, WITEC-RAMAN, RIE-FLUORINE, DRIE, LYRA, ICON-SPM)

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