Glove box


Technology / Methodology:
Nanolitography infrastructure

Location:
CEITEC BUT

Research group:
CF: CEITEC Nano


Technologies for ensuring the dies to be properly interconnected and packaged with high precision, accuracy and reliability to eliminate damage of dies and enable easily manipulation. Supporting inspection technologies should provide the possibility of optical surface monitoring and inspection of interconnection and soldering process. Electrical characterization probe station is also planned, as well as temperature dependencies and working stress testing of fabricated dies.