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Filip Münz, Ph.D.
Technology / Methodology: Nanolitography infrastructure
Instrument status: Operational, 13.5.2019 15:57
Equipment placement: CEITEC Nano - C1.20
Research group: CF: CEITEC Nano
Technologies for ensuring the dies to be properly interconnected and packaged with high precision, accuracy and reliability to eliminate damage of dies and enable easily manipulation. Supporting inspection technologies should provide the possibility of optical surface monitoring and inspection of interconnection and soldering process. Electrical characterization probe station is also planned, as well as temperature dependencies and working stress testing of fabricated dies.