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Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
STRAIN
Kunz, L; Lukas, P; Pantelejev, L; Man, O, 2011: Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition. STRAIN 47(6), p. 476 - 482, doi: 10.1111/j.1475-1305.2009.00710.x
Research Groups:
- Advanced Instrumentation and Methods for Materials Characterization
- High Performance Materials and Coatings for Industry
- Biophotonics Core Facility
CEITEC authors: