Semiautomatic dicing saw ESEC 8003 (DICING-SAW)

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Guarantor: Radovan Klusák
Instrument status: Operational Operational, 11.5.2018 14:42, Only for CF staff (for full-service ask Radovan Klusak)
Research group: CF: CEITEC Nano


Detailed description:

A precision machine for cuting semiconductor wafers into individual chips or dice.