Semiautomatic dicing saw DAD 3220 (DISCO-DICING-SAW)
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Guarantor:
Radovan Klusák
Instrument status:
Operational, 26.6.2023 14:27
Research group:
CF: CEITEC Nano
Description:
A precision machine for cuting semiconductor wafers into individual chips or dice. Wafer sizes up to 6 inches made of Si, SiC, glass up to 1 mm thick.