Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles

ELECTRONIC MATERIALS LETTERS

Pesina, Z; Vykoukal, V; Palcut, M; Sopousek, J, 2014: Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles. ELECTRONIC MATERIALS LETTERS 10(1), p. 293 - 298, doi: 10.1007/s13391-013-3148-5