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THE LECTURE HAS BEEN CANCELLED

ENABLING NEXT-GENERATION ELECTRONIC DEVICES 
BY INNOVATIVE THIN FILM TECHNOLOGIES

The emerging Internet of Things (IoT) and 5G networks, combined with the ongoing miniaturization and improved functionality of portable electronic devices, has led to an increasing demand for heterogeneous technologies (e.g. optoelectronic components, radio-frequency filters, non-volatile memories, low-power sensors, power management, MEMS, etc.) that need to be integrated with the ubiquitous Si-CMOS platform. The realization of these challenging monolithic architectures necessitates numerous surface engineering processes, the combination of advanced thin film materials with precisely designed physical and chemical properties, and corresponding equipment concepts for high volume manufacturing.
This talk will illustrate some of these challenges using examples from different areas, where thin film systems enable the requested functions for next-generation electronic devices. These encompass transparent conductive oxides for micro-LED displays, soft magnetic multilayers that form the inductor cores for high-frequency on-chip voltage regulators, and enhanced permeability dielectrics for Magnetoresistive Random Access Memory (MRAM) and nanomagnetic logic devices.