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Mitigating Curtaining Artifacts During Ga FIB TEM Lamella Preparation of a 14 nm FinFET Device
MICROSCOPY AND MICROANALYSIS
Andrey Denisyuk, Tomáš Hrnčíř, Jozef Vincenc Oboňa, Sharang, Martin Petrenec, Jan Michalička, 2017: Mitigating Curtaining Artifacts During Ga FIB TEM Lamella Preparation of a 14 nm FinFET Device. MICROSCOPY AND MICROANALYSIS , p. 484 - 10, doi: 10.1017/S1431927617000241; FULL TEXT
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