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Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy
JOURNAL OF ELECTRONIC MATERIALS
Sopousek, J; Palcut, M; Hodulova, E; Janovec, J, 2010: Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. JOURNAL OF ELECTRONIC MATERIALS 39(3), p. 312 - 317, doi: 10.1007/s11664-009-1070-2