Wire bonder TPT HB 16 (WIRE-BONDER)

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Guarantor: Marek Vaňatka
Technology / Methodology: Packaging & Testing
Instrument status: Operational Operational, 9.2.2018 17:08
Equipment placement: CEITEC Nano - C1.57
Research group: CF: CEITEC Nano


Detailed description:

Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding. The welding process is realized by wire attached to the substrate by bonding tool at the end of ultrasonic transducer, which is getting closer to certain distance to the sample surface. To achieve enhanced welding capability, sample is heated up to a certain temperature, for most processes being in the range from 20 °C to 250 °C. Attachment techniques defined by bonder tools are performed by wedge-wedge, ball-wedge, ribbon and bump bonding class.


Publications:

  • Svatos, V; Gablech, I; Pekarek, J; Klempa, J; Neuzil, P, 2018: Precise determination of thermal parameters of a microbolometer. INFRARED PHYSICS & TECHNOLOGY 93, p. 286 - 290, doi: 10.1016/j.infrared.2018.07.037
    (WIRE-BONDER)
  • Křižáková, V., 2018: Spin wave excitation and propagation in magnonic crystals prepared by focused ion beam direct writing. MASTER´S THESIS , p. 1 - 83
    (LYRA, HELIOS, ICON-SPM, MIRA, EVAPORATOR, WIRE-BONDER, KERR-MICROSCOPE)
  • Procházka, P., 2018: Fabrication of graphene and study of its physical properties. PH.D. THESIS , p. 1 - 139
    (ALD, DIENER, EVAPORATOR, MIRA, PECVD, TERS, WIRE-BONDER)
  • Chmela, O.; Sadílek, J.; Domènech-Gil, G.; Samà, J.; Somer, J.; Mohan, R.; Romano-Rodriguez, A.; Hubálek, J.; Vallejos, S., 2018: Selectively arranged single-wire based nanosensor array systems for gas monitoring. NANOSCALE 10(19), p. 9087 - 9096, doi: 10.1039/C8NR01588K
    (RAITH, DWL, KAUFMAN, MAGNETRON, SCIA, RIE-FLUORINE, WIRE-BONDER, RIGAKU3)
  • Prochazka, P; Marecek, D; Liskova, Z; Cechal, J; Sikola, T, 2017: X-ray induced electrostatic graphene doping via defect charging in gate dielectric. SCIENTIFIC REPORTS 7, doi: 10.1038/s41598-017-00673-z
    (MIRA, DIENER, ALD, WIRE-BONDER)

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