Wire bonder TPT HB 16 (WIRE-BONDER)

CONTACT US

Guarantor: Robert Dóczy
Technology / Methodology: Packaging & Testing
Instrument status: Operational Operational, 9.2.2018 17:08
Equipment placement: CEITEC Nano - C1.57
Research group: CF: CEITEC Nano


Detailed description:

Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding. The welding process is realized by wire attached to the substrate by bonding tool at the end of ultrasonic transducer, which is getting closer to certain distance to the sample surface. To achieve enhanced welding capability, sample is heated up to a certain temperature, for most processes being in the range from 20 °C to 250 °C. Attachment techniques defined by bonder tools are performed by wedge-wedge, ball-wedge, ribbon and bump bonding class.


Publications:

  • Prochazka, P; Marecek, D; Liskova, Z; Cechal, J; Sikola, T, 2017: X-ray induced electrostatic graphene doping via defect charging in gate dielectric. SCIENTIFIC REPORTS 7, doi: 10.1038/s41598-017-00673-z
    (MIRA, DIENER, ALD, WIRE-BONDER)
  • Mach, J; Prochazka, P; Bartosik, M; Nezval, D; Piastek, J; Hulva, J; Svarc, V; Konecny, M; Kormos, L; Sikola, T, 2017: Electronic transport properties of graphene doped by gallium. NANOTECHNOLOGY 28(41), doi: 10.1088/1361-6528/aa86a4
    (DIENER, DWL, EVAPORATOR, WIRE-BONDER, LYRA)
  • Hrdy, R; Kynclova, H; Klepacova, I; Bartosik, M; Neuzil, P, 2017: Portable Lock-in Amplifier-Based Electrochemical Method to Measure an Array of 64 Sensors for Point-of-Care Applications. ANALYTICAL CHEMISTRY 89(17), p. 8731 - 8737, doi: 10.1021/acs.analchem.7b00776
    (MPS150, WIRE-BONDER)
  • Vanatka, M; Urbanek, M; Jira, R; Flajsman, L; Dhankhar, M; Im, MY; Michalicka, J; Uhlir, V; Sikola, T, 2017: Magnetic vortex nucleation modes in static magnetic fields. AIP ADVANCES 7(10), doi: 10.1063/1.5006235
    (DWL, EVAPORATOR, RAITH, TITAN, WIRE-BONDER)
  • Turčan, I., 2017: Study of Magnonic Crystals in a Frequency Domain. MASTER´S THESIS , p. 1 - 55
    (MIRA, EVAPORATOR, MAGNETRON, WIRE-BONDER)

Show more publications...