Wire bonder TPT HB 16 (WIRE-BONDER)

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Guarantor: Radim Hrdý, Ph.D.
Technology / Methodology: Packaging & Testing
Instrument status: Operational Operational, 19.12.2025 16:06
Equipment placement: CEITEC Nano - C1.57
Research group: CF: CEITEC Nano


Description:

Technologies for ensuring the dies to be properly interconnected and packaged with high precision, accuracy and reliability to eliminate damage of dies and enable easily manipulation. Supporting inspection technologies should provide the possibility of optical surface monitoring and inspection of interconnection and soldering process. Electrical characterization probe station is also planned, as well as temperature dependencies and working stress testing of fabricated dies.


Publications:

  • Děcký, M., 2025: . MASTER'S THESIS , p. 1 - 63; FULL TEXT
    (MIRA-EBL, SUSS-MA8, DEKTAK, NANOCALC, MAGNETRON, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, MPS150, LYRA, LASER-DICER)
  • SUPALOVÁ, L.; BARTOŠÍK, M.; ŠVARC, V.; MACH, J.; PIASTEK, J.; ŠPAČEK, O.; KONEČNÝ, M.; ŠIKOLA, T., 2025: High-Temperature Ultrasensitive FET-Based CVD Graphene Hall Probes. ACS APPLIED ELECTRONIC MATERIALS 7(13), p. 5889 - 5897, doi: 10.1021/acsaelm.5c00351; FULL TEXT
    (DWL, SUSS-MA8, EVAPORATOR, MIRA-EBL, RIE-FLUORINE, WIRE-BONDER, WITEC-RAMAN, LYRA)
  • Horký, M., 2025: . PH.D. THESIS , p. 1 - 181; FULL TEXT
    (RAITH, MIRA-EBL, LYRA, TEGRAMIN, SUSS-MA8, DEKTAK, NANOCALC, MAGNETRON, EVAPORATOR, RIE-FLUORINE, WIRE-BONDER, MPS150, CRYOGENIC, LAKESHORE, VERSALAB, ICON-SPM, UHV-PREPARATION, TITAN, HELIOS, VERIOS, RIGAKU3, RIGAKU9)
  • TAKHSHA GHAHFAROKHI, M.; HORKÝ, M.; NASI, L.; KOSOGOR, A.; TREVISI, G.; CASOLI, F.; ARREGI URIBEETXEBARRIA, J.; BRESCIA, R.; UHLÍŘ, V.; ALBERTINI, F., 2025: Spatially confined magnetic shape-memory Heuslers: Implications for nanoscale devices. ACTA MATERIALIA 284, p. 1 - 11, doi: 10.1016/j.actamat.2024.120579; FULL TEXT
    (VERIOS, MIRA-EBL, RIE-FLUORINE, VERSALAB, WIRE-BONDER)
  • Kunc, J.; Fridrišek, T.; Shestopalov, M.; Jo, J.; Park, K., 2024: . AIP ADVANCES 14(9), p. 1 - 9, doi: 10.1063/5.0223763; FULL TEXT
    (RAITH, RIE-FLUORINE, ALD-FIJI, EVAPORATOR, WIRE-BONDER, KRATOS-XPS)

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