Wire bonder TPT HB 16 (WIRE-BONDER)

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Guarantor: Marek Vaňatka
Technology / Methodology: Packaging & Testing
Instrument status: Operational Operational, 9.2.2018 17:08
Equipment placement: CEITEC Nano - C1.57
Research group: CF: CEITEC Nano


Detailed description:

Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding. The welding process is realized by wire attached to the substrate by bonding tool at the end of ultrasonic transducer, which is getting closer to certain distance to the sample surface. To achieve enhanced welding capability, sample is heated up to a certain temperature, for most processes being in the range from 20 °C to 250 °C. Attachment techniques defined by bonder tools are performed by wedge-wedge, ball-wedge, ribbon and bump bonding class.


Publications:

  • Gablech, I.; Klempa, J.; Pekárek, J.; Vyroubal, P.; Hrabina, J.; Holá, M.; Kunz, J.; Brodský, J.; Neužil, P., 2020: Simple and Efficient AlN-Based Piezoelectric Energy Harvesters. MICROMACHINES 11(2), p. 143-1 - 143-10, doi: 10.3390/mi11020143
    (DRIE, KAUFMAN, RIE-CHLORINE, WIRE-BONDER, DIENER, DWL, SUSS-MA8, SUSS-RCD8)
  • Chmela, O., 2020: Progress toward the development of single nanowire-based arrays for gas sensing applications. PH.D THESIS , p. 1 - 199
    (ALD, DWL, KAUFMAN, DIENER, SUSS-MA8, SUSS-RCD8, RAITH, MAGNETRON, EVAPORATOR, RIE-FLUORINE, SCIA, DEKTAK, ICON-SPM, NANOCALC, MPS150, WIRE-BONDER)
  • Hache, T; Vanatka, M; Flajsman, L; Weinhold, T; Hula, T; Ciubotariu, O; Albrecht, M; Arkook, B; Barsukov, I; Fallarino, L; Hellwig, O; Fassbender, J; Urbanek, M; Schultheiss, H, 2020: Freestanding Positionable Microwave-Antenna Device for Magneto-Optical Spectroscopy Experiments. PHYSICAL REVIEW APPLIED 13(5), p. 054009-1 - 054009-10, doi: 10.1103/PhysRevApplied.13.054009
    (RAITH, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, BRILLOUIN)
  • Hegrová, V., 2019: Application of correlative AFM/SEM microscopy. MASTER´S THESIS , p. 1 - 64
    (LYRA, LITESCOPE, MIRA, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER)
  • Citterberg, D., 2019: Integration of nanostuctures into functional devices. MASTER´S THESIS , p. 1 - 50
    (MIRA, EVAPORATOR, WITEC-RAMAN, WIRE-BONDER, TITAN, MPS150)

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