Wire bonder TPT HB 16 (WIRE-BONDER)

Profilová karta (PDF)

Detailed description:

Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding. The welding process is realized by wire attached to the substrate by bonding tool at the end of ultrasonic transducer, which is getting closer to certain distance to the sample surface. To achieve enhanced welding capability, sample is heated up to a certain temperature, for most processes being in the range from 20 °C to 250 °C. Attachment techniques defined by bonder tools are performed by wedge-wedge, ball-wedge, ribbon and bump bonding class.

Publications:

• Gablech, I.; Klempa, J.; Pekárek, J.; Vyroubal, P.; Hrabina, J.; Holá, M.; Kunz, J.; Brodský, J.; Neužil, P., 2020: Simple and Efficient AlN-Based Piezoelectric Energy Harvesters. MICROMACHINES 11(2), p. 143-1 - 143-10, doi: 10.3390/mi11020143
  (DRIE, KAUFMAN, RIE-CHLORINE, WIRE-BONDER, DIENER, DWL, SUSS-MA8, SUSS-RCD8)
• Chmela, O., 2020: Progress toward the development of single nanowire-based arrays for gas sensing applications. PH.D THESIS , p. 1 - 199
  (ALD, DWL, KAUFMAN, DIENER, SUSS-MA8, SUSS-RCD8, RAITH, MAGNETRON, EVAPORATOR, RIE-FLUORINE, SCIA, DEKTAK, ICON-SPM, NANOCALC, MPS150, WIRE-BONDER)
• Hache, T; Vanatka, M; Flajsman, L; Weinhold, T; Hula, T; Ciubotariu, O; Albrecht, M; Arkook, B; Barsukov, I; Fallarino, L; Hellwig, O; Fassbender, J; Urbanek, M; Schultheiss, H, 2020: Freestanding Positionable Microwave-Antenna Device for Magneto-Optical Spectroscopy Experiments. PHYSICAL REVIEW APPLIED 13(5), p. 054009-1 - 054009-10, doi: 10.1103/PhysRevApplied.13.054009
  (RAITH, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, BRILLOUIN)
• Hegrová, V., 2019: Application of correlative AFM/SEM microscopy. MASTER´S THESIS , p. 1 - 64
  (LYRA, LITESCOPE, MIRA, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER)
• Citterberg, D., 2019: Integration of nanostuctures into functional devices. MASTER´S THESIS , p. 1 - 50
  (MIRA, EVAPORATOR, WITEC-RAMAN, WIRE-BONDER, TITAN, MPS150)

• Křižáková, V., 2018: Spin wave excitation and propagation in magnonic crystals prepared by focused ion beam direct writing. MASTER´S THESIS , p. 1 - 83
  (LYRA, HELIOS, ICON-SPM, MIRA, EVAPORATOR, WIRE-BONDER, KERR-MICROSCOPE)
• Procházka, P., 2018: Fabrication of graphene and study of its physical properties. PH.D. THESIS , p. 1 - 139
  (ALD, DIENER, EVAPORATOR, MIRA, PECVD, TERS, WIRE-BONDER)
• Chmela, O.; Sadílek, J.; Domènech-Gil, G.; Samà, J.; Somer, J.; Mohan, R.; Romano-Rodriguez, A.; Hubálek, J.; Vallejos, S., 2018: Selectively arranged single-wire based nanosensor array systems for gas monitoring. NANOSCALE 10(19), p. 9087 - 9096, doi: 10.1039/C8NR01588K
  (RAITH, DWL, KAUFMAN, MAGNETRON, SCIA, RIE-FLUORINE, WIRE-BONDER, RIGAKU3)
• Svatos, V; Gablech, I; Pekarek, J; Klempa, J; Neuzil, P, 2018: Precise determination of thermal parameters of a microbolometer. INFRARED PHYSICS & TECHNOLOGY 93, p. 286 - 290, doi: 10.1016/j.infrared.2018.07.037
  (WIRE-BONDER)
• Holobrádek, J., 2017: Transport Properties of One Magnetic Nanostructures. BACHELOR´S THESIS , p. 1 - 48
  (TITAN, ICON-SPM, MIRA, EVAPORATOR, WIRE-BONDER, CRYOGENIC)
• Citterberg, D., 2017: Preparation of contacts to one-dimensional nanostructurs. BACHELOR´S THESIS , p. 1 - 26
  (DWL, MIRA, WIRE-BONDER, EVAPORATOR)
• Vaňatka, M., 2017: Fabrication and characterization of nanostructures with functional properties in the field of spintronics. TREATISE TO STATE DOCTORAL EXAM , p. 1 - 31
  (TITAN, MIRA, EVAPORATOR, MAGNETRON, WIRE-BONDER, LYRA)
• Prochazka, P; Marecek, D; Liskova, Z; Cechal, J; Sikola, T, 2017: X-ray induced electrostatic graphene doping via defect charging in gate dielectric. SCIENTIFIC REPORTS 7, doi: 10.1038/s41598-017-00673-z
  (MIRA, DIENER, ALD, WIRE-BONDER)
• Mach, J; Prochazka, P; Bartosik, M; Nezval, D; Piastek, J; Hulva, J; Svarc, V; Konecny, M; Kormos, L; Sikola, T, 2017: Electronic transport properties of graphene doped by gallium. NANOTECHNOLOGY 28(41), doi: 10.1088/1361-6528/aa86a4
  (DIENER, DWL, EVAPORATOR, WIRE-BONDER, LYRA)
• Hrdy, R; Kynclova, H; Klepacova, I; Bartosik, M; Neuzil, P, 2017: Portable Lock-in Amplifier-Based Electrochemical Method to Measure an Array of 64 Sensors for Point-of-Care Applications. ANALYTICAL CHEMISTRY 89(17), p. 8731 - 8737, doi: 10.1021/acs.analchem.7b00776
  (MPS150, WIRE-BONDER)
• Vanatka, M; Urbanek, M; Jira, R; Flajsman, L; Dhankhar, M; Im, MY; Michalicka, J; Uhlir, V; Sikola, T, 2017: Magnetic vortex nucleation modes in static magnetic fields. AIP ADVANCES 7(10), doi: 10.1063/1.5006235
  (DWL, EVAPORATOR, RAITH, TITAN, WIRE-BONDER)
• Turčan, I., 2017: Study of Magnonic Crystals in a Frequency Domain. MASTER´S THESIS , p. 1 - 55
  (MIRA, EVAPORATOR, MAGNETRON, WIRE-BONDER)
• Lišková, Z., 2015: Fabrication of Nanostructures and Nanodevices for Nanoelectronics and Spintronics. PH.D. THESIS , p. 1 - 106
  (LYRA, MIRA, DIENER, NANOCALC, DWL, EVAPORATOR, WIRE-BONDER, ALD)
• Švarc, V., 2015: Shielding effect of oxide isolating layer on surface potential measured by Kelvin probe force microscopy. MASTER´S THESIS , p. 1 - 50
  (LYRA, ALD, DIENER, WIRE-BONDER)
• Kormoš, L., 2015: Application of Graphene Membrane in Nanoelectronic Devices. MASTER´S THESIS , p. 1 - 59
  (LYRA, DIENER, WIRE-BONDER)
• Urbanek, M; Uhlir, V; Lambert, CH; Kan, JJ; Eibagi, N; Vanatka, M; Flajsman, L; Kalousek, R; Im, MY; Fischer, P; Sikola, T; Fullerton, EE, 2015: Dynamics and efficiency of magnetic vortex circulation reversal. PHYSICAL REVIEW B 91(9), doi: 10.1103/PhysRevB.91.094415
  (MIRA, LYRA, WIRE-BONDER)

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