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We perform non-destructive X-ray analysis of soldered joints, enabling detailed inspection of their internal structure and identification of potential defects without damaging the analyzed components. The method is used for quality control, research and development, failure analysis, and manufacturing process optimization.
Method
The analysis of soldered joints uses microfocus X-ray imaging to examine the internal structure of electronic components and joints in both 2D and 3D. High resolution and precise positioning enable detailed analysis of individual areas and the detection of defects that cannot be identified by conventional optical inspection.
The method can be used particularly for solder joint inspection, research and development, failure analysis, and manufacturing process and quality control.
Equipment
The analysis is performed using the Microme|x microfocus X-ray inspection system, which combines high positioning accuracy with advanced imaging capabilities to support a wide range of 2D and 3D X-ray inspection tasks.
