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Evaluation of the Topographical Surface Changes of Silicon Wafers after Annealing and Plasma Cleaning

SILICON

STACH, S.; TALU, S.; DALLAEV, R.; ARMAN, A.; SOBOLA, D.; SALERNO, M., 2020: Evaluation of the Topographical Surface Changes of Silicon Wafers after Annealing and Plasma Cleaning. SILICON 12(11), p. 2563 - 8, doi: 10.1007/s12633-019-00351-x; FULL TEXT

Research Groups:

• Advanced Instrumentation and Methods for Materials Characterization

CEITEC authors:

• Dinara Sobola, Ph.D.