Infinite selectivity of wet SiO2 etching in respect to Al
MICROMACHINES
GABLECH, I.; BRODSKÝ, J.; PEKÁREK, J.; NEUŽIL, P., 2020: Infinite selectivity of wet SiO2 etching in respect to Al. MICROMACHINES 11(4), p. 365 - 7, doi: 10.3390/mi11040365; FULL TEXT
(EVAPORATOR, SUSS-MA8, RIE-CHLORINE, DWL, SUSS-RCD8)
Equipment:
- Electron beam evaporator BESTEC
- Mask Aligner, NanoImprint Lithography SÜSS MicroTec MA8/BA8 Gen3
- RIE by Chlorine Chemistry Oxford Instruments Plasma Technology PlasmaPro 100
- UV Direct Write Laser system Heidelberg Instruments DWL 66-fs
- Resist coating and development system SÜSS MicroTec RCD8
Research Groups:
CEITEC authors: